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Legrand, a global provider of electrical and digital building infrastructure, is presenting its focus on open, scalable data centre architectures. Its portfolio, aligned with Open Compute Project (OCP) standards, will be featured at the OCP EMEA Summit. The company aims to support OCP adoption through engineering and design capabilities intended to increase flexibility, scalability, and deployment efficiency.
With growing demand from AI and high-performance computing workloads, data centre operators are increasingly evaluating traditional designs to support higher power densities and changing workload requirements. OCP architectures are used to support energy efficiency, scalability, and simplified integration for infrastructure intended for AI and digital services.
At the summit, Legrand will present OCP-aligned rack and power solutions designed to support white-space architecture and scalable deployment. The ORv3-compliant portfolio includes a 33kW power shelf with Xerus firmware, a vertical 48VDC busbar available in configurations up to 1400A, and an ORv3 rack supporting loads up to 2,300 kg. The Smart Rack Controller (SRC2) integrates with the ORv3 48VDC busbar to provide environmental monitoring and sensor management at rack level.
Legrand is also introducing a 48VDC-ready Rear Door Heat Exchanger (RDHx), which connects to the rack’s DC busbar to support power delivery and reduce conversion stages. This is intended to support deployment of high-density cooling within ORv3-aligned architectures and streamline electrical design for higher thermal loads.
Legrand continues to invest in solutions intended to support data centre operators in deploying infrastructure, managing performance, and adapting to workload requirements associated with AI, high-performance computing, and cloud-scale applications.
